LidroCUT® - Laser Dicing in Liquids
The latest innovation in wafer dicing technology – ready to be cutting edge?
Our innovation combines opposites
Excellent quality and highest precision in cutting microchips and devices (wafer dicing) are the main features of Lidrotec’s innovative laser technology. With it, we set new standards for a variety of industries: semiconductor, energy, medicine, electronics and material science.
While the processing is done by a laser, we use controlled fluids, which perform several crucial functions at the same time: efficient cooling of the workpiece surface (» no heat input – no microcracks), binding and rinsing of nano- and microparticles (» no debris on the surface), and optimization of laser ablation due to the physicochemical interactions between laser beam, liquid and workpiece.
OUR UNIQUE TECHNOLOGY FEATURES
Quality
Burr-free and sharp cutting edges lead to less scrap and increase production yield
Precision
Minimal cutting widths and a high aspect ratio increase the number of chips on each wafer
Freeform cutting
Cleanliness
The surface of the chips is clean and requires no additional post-treatment steps
Material independency
All materials can be cut, eliminating the need for complex production steps like step-cuts
Flexibility
Full cuts, structuring, grooving, and functionalization – all possibilities in one machine
Semiconductor production mastery
Maximize yield, uptime, and efficiency with our advanced machine. Streamline processes by scribing and dicing in a single step, eliminating the need for coating. Elevate your semiconductor manufacturing with innovation and precision.
Precision at every step
Unlock the full potential of semiconductor manufacturing with our machine’s versatile capabilities. From full cut, trim, and groove to seamless tape frame application, our technology ensures precision. Ideal for cleanroom environments, it sets the standard for high-quality production.
Streamlined Efficiency & enhanced control
Experience convenience with our plug & play application. The integrated SECS/GEM interface ensures seamless communication and streamlined operations. Elevate your semiconductor manufacturing effortlessly with user-friendly features and enhanced control.
Cutting-edge innovation
Explore unparalleled advantages in semiconductor production with our cutting-edge machine. Simplify processes, eliminate coating needs, and cut multi-project wafers to reduce inspection efforts. Elevate your manufacturing with our innovative solution.
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The latest innovation in wafer dicing technology - ready to be cutting edge?
Would you like to learn more about our cutting-edge laser technology and have a thorough understanding of the various ways that this technology is changing the world?
If so, we cordially encourage you to download our brochure, which is made to expand your knowledge and acquaint you with the various uses and possibilities of our technology.
Semiconductor equipment
– Made in Germany
Our team & open positions
Get in touch with the founders or see all job offers and directly become a part of the team.
Contact us
We’d be pleased to provide detailed insights into our technology, discuss feasibility studies and contract manufacturing options, and offer guidance on all aspects of wafer dicing in liquids.
CONTACT
ADDRESS
Lidrotec GmbH
Lothringer Allee 2
44805 Bochum
Germany